The Effect of Ni Interlayer Formation Plating Bath on the Suppression of Oxidation of Ag-Coated Cu Flakes

To suppress Ag dewetting from around 200 <sup>o</sup>C in Ag-coated Cu (Cu@Ag) flakes, and Ni-coated (Cu@Ni@Ag) flakes were fabricated by successive Ni electroless plating. The bath type was an important consideration to induce differences the resultant oxidation. An acid contained succinic as a complexing agent sodium hypophosphite reductant, alkaline citrate hydroxide pH adjuster well hypophosphite. A hydrazine-based citrate, hydroxide, hydrazine hydrate reductant. provided amorphous coatings with P content of approximately 10 wt%. Cu@Ni@Ag started oxidation at 350 <sup>o</sup>C, together formation Ni<sub>3</sub>P phase. Meanwhile, created Ni-5 wt% coatings, which transformed into crystalline phase after heating <sup>o</sup>C. shell dewetted 450 caused flakes. Finally, formed without P, induced rapid mixing core Cu. shells on mixed Cu-Ni alloy showed repressed behavior, thus temperature highest, such 500 Enhancing high resistance 300 will enable use low-cost filler material conductive pastes, especially for long-time or high-temperature curing.